Development of probe for thermal conductivity measurement of food materials under heated and pressurized conditions

M. Shariaty-Niassar, M. Hozawa, T. Tsukada

Research output: Contribution to journalArticlepeer-review

23 Citations (Scopus)

Abstract

The probe measuring the thermal conductivity of food materials under pressurized conditions over a wide temperature range was developed. The measurement was based on the transient hot wire method. The validity of the data measured using this probe was verified by comparison with published data of water. The thermal conductivity of gelatinized potato starches was determined at 25-80 °C, 50-80% moisture, and 0.2-10 MPa. It was found that the thermal conductivity of the starch gel increases with temperature and moisture content, and that it increases with pressure up to 1 MPa, above which it remains almost constant.

Original languageEnglish
Pages (from-to)133-139
Number of pages7
JournalJournal of Food Engineering
Volume43
Issue number3
DOIs
Publication statusPublished - 2000 Feb

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