Development of self-assembled 3-D integration technology and study of microbump and TSV induced stress in thinned chip/wafer

T. Tanaka, T. Fukushima, K. W. Lee, M. Murugesan, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publication2010 IEEE International SOI Conference, SOI 2010
DOIs
Publication statusPublished - 2010
Event2010 IEEE International Silicon on Insulator Conference, SOI 2010 - San Diego, CA, United States
Duration: 2010 Oct 112010 Oct 14

Publication series

NameProceedings - IEEE International SOI Conference
ISSN (Print)1078-621X

Conference

Conference2010 IEEE International Silicon on Insulator Conference, SOI 2010
Country/TerritoryUnited States
CitySan Diego, CA
Period10/10/1110/10/14

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