TY - JOUR
T1 - Development of the next generation Si wafer transfer/stock system
AU - Kanechika, Yukihiro
AU - Kawaguchi, Takashi
AU - Kawaguchi, Takashi
AU - Jimbo, Toshihiko
AU - Yamasaki, Masahiro
AU - Hirayama, Masaki
AU - Shirai, Yasuyulu
AU - Ohmi, Tadahiro
PY - 2001
Y1 - 2001
N2 - Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).
AB - Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).
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U2 - 10.1109/ISSM.2001.963023
DO - 10.1109/ISSM.2001.963023
M3 - Article
AN - SCOPUS:0035165718
SN - 1523-553X
SP - 495
EP - 498
JO - IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
JF - IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings
ER -