Clean room air contains many kinds of contaminants such as moisture and organic compounds. The device performance is influenced on them, therefore, Si wafer should not be exposed to clean room air. We have developed the next generation Si wafer transfer/stock system using the out-gas free advanced resin and CDA (Clean Dry Air). The advanced resin has various advantageous properties for Si wafer transfer box and stocker. For example, (1)out-gas free, (2)light weight, (3)high transparency, (4)high strength, etc. Using the advanced resin, we have developed a newly Si wafer transfer pod, called BORP(Bottom Opening Removal Pod).
|Number of pages||4|
|Journal||IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings|
|Publication status||Published - 2001|