TY - GEN
T1 - Development of thermodynamic database for micro-soldering alloys
AU - Ohnuma, I.
AU - Liu, X. J.
AU - Ohtani, H.
AU - Anzai, K.
AU - Kainuma, R.
AU - Ishida, K.
N1 - Publisher Copyright:
© 2000 IEEE.
PY - 2000
Y1 - 2000
N2 - Recent progress on the database of calculated phase diagrams in micro-soldering alloy systems, which consist of Pb, Bi, Sn, Sb, Cu, Ag, In and Zn, is presented. Experimental determination of phase equilibria was conducted in several binary, ternary and quaternary systems by DSC, EDX and X-ray diffraction techniques. Based on these experiments, as well as on previous data on phase diagrams and thermo-chemical properties such as activity, heat of mixing and enthalpy of formation, the various thermodynamic parameters for describing the Gibbs energies of the different constituent phases were optimized and evaluated by the CALPHAD (calculation of phase diagrams) method. The database provides key information on liquidus and solidus surfaces, isothermal and vertical section diagrams, and mole fractions of the phase constitutions of multi-component soldering alloys. Thermodynamic properties of the surface tension and viscosity of the liquid phase can also be predicted. Moreover, a nonequilibrium solidification process using the Scheil model was simulated. Several phase diagrams of Pb-bearing and Pb-free solders are presented. The database is expected to be a powerful tool and an indispensable resource for the development of new Pb-free solders.
AB - Recent progress on the database of calculated phase diagrams in micro-soldering alloy systems, which consist of Pb, Bi, Sn, Sb, Cu, Ag, In and Zn, is presented. Experimental determination of phase equilibria was conducted in several binary, ternary and quaternary systems by DSC, EDX and X-ray diffraction techniques. Based on these experiments, as well as on previous data on phase diagrams and thermo-chemical properties such as activity, heat of mixing and enthalpy of formation, the various thermodynamic parameters for describing the Gibbs energies of the different constituent phases were optimized and evaluated by the CALPHAD (calculation of phase diagrams) method. The database provides key information on liquidus and solidus surfaces, isothermal and vertical section diagrams, and mole fractions of the phase constitutions of multi-component soldering alloys. Thermodynamic properties of the surface tension and viscosity of the liquid phase can also be predicted. Moreover, a nonequilibrium solidification process using the Scheil model was simulated. Several phase diagrams of Pb-bearing and Pb-free solders are presented. The database is expected to be a powerful tool and an indispensable resource for the development of new Pb-free solders.
KW - Bismuth
KW - Copper alloys
KW - Databases
KW - Isothermal processes
KW - Optimization methods
KW - Solid modeling
KW - Thermodynamics
KW - Tin alloys
KW - X-ray diffraction
KW - Zinc
UR - http://www.scopus.com/inward/record.url?scp=84949551569&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84949551569&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2000.906355
DO - 10.1109/EPTC.2000.906355
M3 - Conference contribution
AN - SCOPUS:84949551569
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
SP - 91
EP - 96
BT - Proceedings of 3rd Electronics Packaging Technology Conference, EPTC 2000
A2 - Lee, Charles
A2 - Toh, Kok Chuan
A2 - Lim, Thiam Beng
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd Electronics Packaging Technology Conference, EPTC 2000
Y2 - 5 December 2000 through 7 December 2000
ER -