Development of wiring boards using single-layer adsorption films and their recycle method

Yuji Suzuki; Masaru Nakagawa; Tomokazu Iyoda

Development of wiring boards using single-layer adsorption films and their recycle method

Yuji Suzuki, Masaru Nakagawa, Tomokazu Iyoda

Research output: Contribution to conference › Paper › peer-review

Abstract

We developed a novel method for recycling wiring polymer boards using a layer-by-layer multilayer of colloidal SiO₂ particles as a separation layer on a PET substrate. A plating-promotion layer of poly(4-vinyl pyridine-co-1-dodecyl-4-vinylpyridinium bromide)(QP4VP) was adsorbed on the colloidal SiO₂ multilayer and patterned by vacuum ultraviolet light irradiation through a photomask. Selective Cu deposition occurred in accordance with the QP4VP photopattern shape and Cu wiring boards could be prepared. The Cu wiring boards were separated readily due to dissolving SiO₂ particle by an alkali NaOH solution. It was found that the colloidal SiO₂ multilayer was available for the separation layer of wiring boards.

Original language	English
Number of pages	1
Publication status	Published - 2005 Dec 1
Externally published	Yes
Event	54th SPSJ Annual Meeting 2005 - Yokohama, Japan Duration: 2005 May 25 → 2005 May 27

Other

Other	54th SPSJ Annual Meeting 2005
Country/Territory	Japan
City	Yokohama
Period	05/5/25 → 05/5/27

Keywords

Electroless plating
Layer-by-layer
Recycle
Sigle-layer adsorption film
Wiring board

ASJC Scopus subject areas

Engineering(all)

Cite this

@conference{d529057607404bdc804b41284ee4add7,

title = "Development of wiring boards using single-layer adsorption films and their recycle method",

abstract = "We developed a novel method for recycling wiring polymer boards using a layer-by-layer multilayer of colloidal SiO2 particles as a separation layer on a PET substrate. A plating-promotion layer of poly(4-vinyl pyridine-co-1-dodecyl-4-vinylpyridinium bromide)(QP4VP) was adsorbed on the colloidal SiO2 multilayer and patterned by vacuum ultraviolet light irradiation through a photomask. Selective Cu deposition occurred in accordance with the QP4VP photopattern shape and Cu wiring boards could be prepared. The Cu wiring boards were separated readily due to dissolving SiO2 particle by an alkali NaOH solution. It was found that the colloidal SiO2 multilayer was available for the separation layer of wiring boards.",

keywords = "Electroless plating, Layer-by-layer, Recycle, Sigle-layer adsorption film, Wiring board",

author = "Yuji Suzuki and Masaru Nakagawa and Tomokazu Iyoda",

year = "2005",

month = dec,

day = "1",

language = "English",

note = "54th SPSJ Annual Meeting 2005 ; Conference date: 25-05-2005 Through 27-05-2005",

}

TY - CONF

T1 - Development of wiring boards using single-layer adsorption films and their recycle method

AU - Suzuki, Yuji

AU - Nakagawa, Masaru

AU - Iyoda, Tomokazu

PY - 2005/12/1

Y1 - 2005/12/1

N2 - We developed a novel method for recycling wiring polymer boards using a layer-by-layer multilayer of colloidal SiO2 particles as a separation layer on a PET substrate. A plating-promotion layer of poly(4-vinyl pyridine-co-1-dodecyl-4-vinylpyridinium bromide)(QP4VP) was adsorbed on the colloidal SiO2 multilayer and patterned by vacuum ultraviolet light irradiation through a photomask. Selective Cu deposition occurred in accordance with the QP4VP photopattern shape and Cu wiring boards could be prepared. The Cu wiring boards were separated readily due to dissolving SiO2 particle by an alkali NaOH solution. It was found that the colloidal SiO2 multilayer was available for the separation layer of wiring boards.

AB - We developed a novel method for recycling wiring polymer boards using a layer-by-layer multilayer of colloidal SiO2 particles as a separation layer on a PET substrate. A plating-promotion layer of poly(4-vinyl pyridine-co-1-dodecyl-4-vinylpyridinium bromide)(QP4VP) was adsorbed on the colloidal SiO2 multilayer and patterned by vacuum ultraviolet light irradiation through a photomask. Selective Cu deposition occurred in accordance with the QP4VP photopattern shape and Cu wiring boards could be prepared. The Cu wiring boards were separated readily due to dissolving SiO2 particle by an alkali NaOH solution. It was found that the colloidal SiO2 multilayer was available for the separation layer of wiring boards.

KW - Electroless plating

KW - Layer-by-layer

KW - Recycle

KW - Sigle-layer adsorption film

KW - Wiring board

UR - http://www.scopus.com/inward/record.url?scp=33645639673&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33645639673&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:33645639673

T2 - 54th SPSJ Annual Meeting 2005

Y2 - 25 May 2005 through 27 May 2005

ER -

Development of wiring boards using single-layer adsorption films and their recycle method

Abstract

Other

Keywords

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this