@inproceedings{90c3f621b8e140b3bab2cdefaf99c9f2,
title = "Development trends in the field of wafer bonding technologies",
abstract = "One well established technology for the fabrication of 3D devices in microelectronics and micro system technology is wafer bonding. After an overview about the existing bonding techniques the presentation will address aspects like bonding with plasma pretreatment to reduce the bond temperature below 200°C, use of nanostructures for bonding, metal to metal bonding and integration of new materials to form special SOI substrates.",
author = "Maik Wiemer and Marco Haubold and Chenping Jia and Dirk W{\"u}nsch and J. Fr{\"o}mel and Thomas Ge{\ss}ner",
year = "2009",
doi = "10.1149/1.2982857",
language = "English",
isbn = "9781566776547",
series = "ECS Transactions",
publisher = "Electrochemical Society Inc.",
number = "8",
pages = "81--92",
booktitle = "ECS Transactions - Semiconductor Wafer Bonding 10",
edition = "8",
note = "Semiconductor Wafer Bonding 10: Science, Technology, and Applications - 214th ECS Meeting ; Conference date: 14-10-2008 Through 16-10-2008",
}