Abstract
BaTiO3 films were deposited by MOCVD at temperature of 973 K and total pressure of 0.2 to 0.8 kPa on Pt - coated fused silica and (100)MgO substrates. Ba(DPM)2 and Ti(O-i-C3H7)2(DPM)2 were used as Ba and Ti sources, respectively. BaTiO3 films in single phase were obtained when the films were deposited at 973 K and Ba/Ti ratio of 0.25 to 0.35. The grain size of BaTiO3 films increased with decreasing total pressure. BaTiO3 polycrystalline films with thickness of 1 μm had dielectric constant of 480, loss tangent of 0.03 and electrical resistivity of 2.1 MΩm at room temperature.
Original language | English |
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Pages | 841-844 |
Number of pages | 4 |
Publication status | Published - 2000 |
Event | 12th IEEE International Symposium on Applications of Ferroelectrics - Honolulu, HI, United States Duration: 2000 Jul 21 → 2000 Aug 2 |
Conference
Conference | 12th IEEE International Symposium on Applications of Ferroelectrics |
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Country/Territory | United States |
City | Honolulu, HI |
Period | 00/7/21 → 00/8/2 |