@article{342a733fc63d43bbb401e8e675df2d98,
title = "Dielectrophoretic assembly of gold nanoparticle arrays evaluated in terms of room-temperature resistance",
abstract = "Gold nanoparticles (GNPs) are often used as island electrodes of single-electron (SE) devices. One of technical challenges in fabrication of SE devices with GNPs is the placement of GNPs in a nanogap between two lead electrodes. Utilization of dielectrophoresis (DEP) phenomena is one of possible solutions for this challenge, whereas the fabrication process with DEP includes stochastic aspects. In this brief paper, we present our experimental results on electric resistance of GNP arrays assembled by DEP. More than 300 pairs of electrodes were investigated under various DEP conditions by trial and error approach. We evaluated the relationship between the DEP conditions and the electric resistance of assembled GNP arrays, which would indicate possible DEP conditions for fabrication of SE devices.",
keywords = "Coulomb blockade, Histogram, Single-electron effect, Tunnel junction",
author = "Yoshinao Mizugaki and Makoto Moribayashi and Tomoki Yagai and Masataka Moriya and Hiroshi Shimada and Ayumi Hirano-Iwata and Fumihiko Hirose",
note = "Funding Information: This work was partly supported by JSPS KAKENHI Grant Number 17K04979, and by JST-CREST Grant Number JPMJCR14F. The authors are grateful to other lab. members in UEC Tokyo for fruitful discussion and technical supports. Nation-wide Cooperative Research Projects, Research Institute of Electrical Communication, Tohoku University are also acknowledged. Funding Information: This work was partly supported by JSPS KAKENHI Grant Number 17K04979, and by JST-CREST Grant Number JP-MJCR14F. The authors are grateful to other lab. members in UEC Tokyo for fruitful discussion and technical supports. Nation-wide Cooperative Research Projects, Research Institute of Electrical Communication, Tohoku University are also acknowledged. Publisher Copyright: Copyright {\textcopyright} 2020 The Institute of Electronics, Information and Communication Engineers",
year = "2020",
doi = "10.1587/transele.2019ECS6011",
language = "English",
volume = "E103C",
pages = "62--65",
journal = "IEICE Transactions on Electronics",
issn = "0916-8524",
publisher = "Maruzen Co., Ltd/Maruzen Kabushikikaisha",
number = "2",
}