A new high-resolution lithographic technique is proposed for employment with a dry-developable multilayer resist system. The technique involves direct pattern fabrication through vapor-phase graft polymerization induced by an electron beam. No wet process is involved in the pattern fabrication. The use of a double layer base film, consisting of a thin silicone resin as a top layer and a thick AZ resist film as a bottom layer, enabled transfer of graft polymerized polystyrene patterns on the silicone resin to a thick resist of submicron-sized features.
|Number of pages||10|
|Journal||Denki Tsushin Kenkyusho Kenkyu Jitsuyoka Hokoku|
|Publication status||Published - 1984 Dec 1|
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