Ductile cutting of a microstructure array on silicon surface by using a diamond tool with a negative rake angle

Yuan Liu Chen; Yindi Cai; Keisuke Tohyama; Yuki Shimizu; So Ito; Wei Gao

Ductile cutting of a microstructure array on silicon surface by using a diamond tool with a negative rake angle

Yuan Liu Chen, Yindi Cai, Keisuke Tohyama, Yuki Shimizu, So Ito, Wei Gao

ENG - Finemechanics

Tohoku University

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper presents an experimental investigation of ductile cutting of silicon by using a diamond tool with a negative rake angle. A diamond cutting tool with a zero rake angle is inclined to form a negative rake angle for a better performance in ductile cutting. A high-sensitivity force sensor is integrated with the tool holder for detection of the tool-sample contact and monitoring the thrust force in the cutting process. The unavoidable sample tilt was probed by using the force sensor integrated diamond tool as a stylus, so that microstructures can be directly fabricated along the tilted workpiece. With accurate tilt compensation, a microstructure array with a good uniformity was successfully fabricated on the silicon surface.

Original language	English
Publication status	Published - 2015 Oct 18
Event	8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015 - Kyoto, Japan Duration: 2015 Oct 18 → 2015 Oct 22

Conference

Conference	8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015
Country/Territory	Japan
City	Kyoto
Period	15/10/18 → 15/10/22

Keywords

Brittle material
Diamond cutting
Force sensor
Nano scratching
Negative rake angle

Cite this

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title = "Ductile cutting of a microstructure array on silicon surface by using a diamond tool with a negative rake angle",

abstract = "This paper presents an experimental investigation of ductile cutting of silicon by using a diamond tool with a negative rake angle. A diamond cutting tool with a zero rake angle is inclined to form a negative rake angle for a better performance in ductile cutting. A high-sensitivity force sensor is integrated with the tool holder for detection of the tool-sample contact and monitoring the thrust force in the cutting process. The unavoidable sample tilt was probed by using the force sensor integrated diamond tool as a stylus, so that microstructures can be directly fabricated along the tilted workpiece. With accurate tilt compensation, a microstructure array with a good uniformity was successfully fabricated on the silicon surface.",

keywords = "Brittle material, Diamond cutting, Force sensor, Nano scratching, Negative rake angle",

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T1 - Ductile cutting of a microstructure array on silicon surface by using a diamond tool with a negative rake angle

AU - Chen, Yuan Liu

AU - Cai, Yindi

AU - Tohyama, Keisuke

AU - Shimizu, Yuki

AU - Ito, So

AU - Gao, Wei

PY - 2015/10/18

Y1 - 2015/10/18

N2 - This paper presents an experimental investigation of ductile cutting of silicon by using a diamond tool with a negative rake angle. A diamond cutting tool with a zero rake angle is inclined to form a negative rake angle for a better performance in ductile cutting. A high-sensitivity force sensor is integrated with the tool holder for detection of the tool-sample contact and monitoring the thrust force in the cutting process. The unavoidable sample tilt was probed by using the force sensor integrated diamond tool as a stylus, so that microstructures can be directly fabricated along the tilted workpiece. With accurate tilt compensation, a microstructure array with a good uniformity was successfully fabricated on the silicon surface.

AB - This paper presents an experimental investigation of ductile cutting of silicon by using a diamond tool with a negative rake angle. A diamond cutting tool with a zero rake angle is inclined to form a negative rake angle for a better performance in ductile cutting. A high-sensitivity force sensor is integrated with the tool holder for detection of the tool-sample contact and monitoring the thrust force in the cutting process. The unavoidable sample tilt was probed by using the force sensor integrated diamond tool as a stylus, so that microstructures can be directly fabricated along the tilted workpiece. With accurate tilt compensation, a microstructure array with a good uniformity was successfully fabricated on the silicon surface.

KW - Brittle material

KW - Diamond cutting

KW - Force sensor

KW - Nano scratching

KW - Negative rake angle

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M3 - Paper

AN - SCOPUS:84974603598

T2 - 8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015

Y2 - 18 October 2015 through 22 October 2015

ER -

Ductile cutting of a microstructure array on silicon surface by using a diamond tool with a negative rake angle

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