Durability and defect distribution of SiOx film on polymer substrate analyzed by a statistical approach

M. Yanaka, Y. Tsukahara, T. Okabe, N. Takeda

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)

Abstract

The progress of multiple cracking in a silicon oxide (SiOx) film deposited onto a polyethylene terephthalate (PET) substrate was analyzed statistically using Monte Carlo simulation. The finite element analysis assuming elasto-plastic behavior of the polymer substrate was conducted to calculate the stress distributions in film fragments and was used in the simulation. The Weibull parameters of the film were determined from the scatter of crack onset strains. The simulation predicted successfully the crack density and the distribution of fragment lengths during the progress of the multiple cracking. The validity of the shear lag analysis based on the unique stress criterion in the previous study was also evaluated.

Original languageEnglish
Pages (from-to)487-491
Number of pages5
JournalProceedings, Annual Technical Conference - Society of Vacuum Coaters
Publication statusPublished - 2001
Event44th Annual Technical Conference Prodeedings - Philadelphia, PA, United States
Duration: 2001 Apr 212001 Apr 26

Keywords

  • Mechanical properties
  • Permeation barrier coatings
  • SiO
  • Weibull analysis

Fingerprint

Dive into the research topics of 'Durability and defect distribution of SiOx film on polymer substrate analyzed by a statistical approach'. Together they form a unique fingerprint.

Cite this