TY - JOUR
T1 - Dynamic scaling in electrochemical deposition
AU - Iwasaki, Hiroshi
AU - Iwamoto, Atsushi
AU - Sudoh, Koichi
AU - Yoshinobu, Tatsuo
PY - 1995
Y1 - 1995
N2 - Atomic force microscopy and numerical simulation were used to study the static and dynamic scaling behavior in copper electrochemical deposition in the stable growth condition. Two distinct scaling regimes with roughness exponent a of 0.6 and 0.87±0.05 were found. The rms surface width of the measured surface in the former regime was smaller than that in the latter regime. The sum of α + (α / β) was larger than the value expected for KPZ local growth, 2. Finally, the smoother (α = 0.6) and the rougher (0.87) surfaces were reproduced by numerical solutions of KPZ +.
AB - Atomic force microscopy and numerical simulation were used to study the static and dynamic scaling behavior in copper electrochemical deposition in the stable growth condition. Two distinct scaling regimes with roughness exponent a of 0.6 and 0.87±0.05 were found. The rms surface width of the measured surface in the former regime was smaller than that in the latter regime. The sum of α + (α / β) was larger than the value expected for KPZ local growth, 2. Finally, the smoother (α = 0.6) and the rougher (0.87) surfaces were reproduced by numerical solutions of KPZ +.
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M3 - Conference article
AN - SCOPUS:0029221744
SN - 0272-9172
VL - 367
SP - 159
EP - 168
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Proceedings of the 1994 MRS Fall Meeting
Y2 - 28 November 1994 through 30 November 1994
ER -