Atomic force microscopy and numerical simulation were used to study the static and dynamic scaling behavior in copper electrochemical deposition in the stable growth condition. Two distinct scaling regimes with roughness exponent a of 0.6 and 0.87±0.05 were found. The rms surface width of the measured surface in the former regime was smaller than that in the latter regime. The sum of α + (α / β) was larger than the value expected for KPZ local growth, 2. Finally, the smoother (α = 0.6) and the rougher (0.87) surfaces were reproduced by numerical solutions of KPZ +.
|Number of pages||10|
|Journal||Materials Research Society Symposium - Proceedings|
|Publication status||Published - 1995|
|Event||Proceedings of the 1994 MRS Fall Meeting - Boston, MA, USA|
Duration: 1994 Nov 28 → 1994 Nov 30