Dynamics of hydrogen-bonded molecular assemblies and their physical properties

    Research output: Contribution to journalArticlepeer-review

    1 Citation (Scopus)

    Abstract

    Dynamic molecular materials have been designed by focusing on the intermolecular hydrogen-bonding interaction in molecular assemblies. For instance, one-dimensional and two-dimensional columnar amide-type hydrogen-bonding interactions of aromatic oligoamide (-CONHCnH2n+1) derivatives were responsible for the external electric field in liquid crystalline state, which induced the polarization inversion and ferroelectricity. Multi-functional ferroelectric organic materials such as fluorescent-ferroelectrics and current switching-ferroelectrics were designed by choosing in a central π-electron core. Mechanically thermoresponsive crystalline materials with high thermal stability were also obtained by designing in the hydrogen-bonding array of dynamic π-molecular system. Through the precise designs of dynamics in molecular assemblies including in the functional π-electron system, "bulk dynamic" properties such as ferroelectricity and thermosalient behavior were coupled with the intrinsic π-electronic properties such as electrical conducting, magnetic, and optical properties. Such multi-functional organic materials have a potential to construct a new molecular science.

    Original languageEnglish
    Pages (from-to)801-812
    Number of pages12
    JournalYuki Gosei Kagaku Kyokaishi/Journal of Synthetic Organic Chemistry
    Volume78
    Issue number8
    DOIs
    Publication statusPublished - 2020 Aug 1

    Keywords

    • Amide
    • Ferroelectricity
    • Hydrogen bond
    • Hydrogen-bonded organic framework
    • Liquid crystal
    • Molecular assembly
    • Molecular motion
    • Thermosalient effect

    ASJC Scopus subject areas

    • Organic Chemistry

    Fingerprint

    Dive into the research topics of 'Dynamics of hydrogen-bonded molecular assemblies and their physical properties'. Together they form a unique fingerprint.

    Cite this