Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti-Ni-Cu thin film microactuator

M. Tomozawa; H. Y. Kim; A. Yamamoto; S. Hiromoto; S. Miyazaki

doi:10.1016/j.actamat.2010.07.024

Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti-Ni-Cu thin film microactuator

M. Tomozawa, H. Y. Kim, A. Yamamoto, S. Hiromoto, S. Miyazaki

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

Ti-Ni-Cu/SiO₂ two layer diaphragm-type microactuators were fabricated by sputter deposition and micromachining. The influence of heat treatment temperature on the actuation behavior was investigated under quasi-static conditions. The interfacial structure of Ti- Ni-Cu/SiO₂ and internal structure of the Ti-Ni-Cu layer were also investigated using transmission electron microscopy. The reaction layer formed between the Ti-Ni-Cu and SiO₂ layers, and preferentially grew into the SiO₂ side. The reaction layer formed at 1023 K mainly consisted of Ti ₄(Ni,Cu)₂O. The maximum height of the diaphragm decreased with increasing heat treatment temperature. The growth of the reaction layer also affected the microstructure of the Ti-Ni-Cu layer. The density of fine platelets and Ti₂Ni precipitates decreased with increasing heat treatment temperature from 873 to 923 K, and they disappeared at 973 K due to the fact that the reaction layer mainly consisted of a Ti-rich phase. The microactuator heat treated at 973 K showed the highest transformation temperature with the lowest transformation temperature hysteresis, which is attractive for high speed actuation.

Original language	English
Pages (from-to)	6064-6071
Number of pages	8
Journal	Acta Materialia
Volume	58
Issue number	18
DOIs	https://doi.org/10.1016/j.actamat.2010.07.024
Publication status	Published - 2010 Oct
Externally published	Yes

Keywords

Microactuator
Shape memory effect
Thin film
Ti-Ni-Cu

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Ceramics and Composites
Polymers and Plastics
Metals and Alloys

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10.1016/j.actamat.2010.07.024

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title = "Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti-Ni-Cu thin film microactuator",

abstract = "Ti-Ni-Cu/SiO2 two layer diaphragm-type microactuators were fabricated by sputter deposition and micromachining. The influence of heat treatment temperature on the actuation behavior was investigated under quasi-static conditions. The interfacial structure of Ti- Ni-Cu/SiO2 and internal structure of the Ti-Ni-Cu layer were also investigated using transmission electron microscopy. The reaction layer formed between the Ti-Ni-Cu and SiO2 layers, and preferentially grew into the SiO2 side. The reaction layer formed at 1023 K mainly consisted of Ti 4(Ni,Cu)2O. The maximum height of the diaphragm decreased with increasing heat treatment temperature. The growth of the reaction layer also affected the microstructure of the Ti-Ni-Cu layer. The density of fine platelets and Ti2Ni precipitates decreased with increasing heat treatment temperature from 873 to 923 K, and they disappeared at 973 K due to the fact that the reaction layer mainly consisted of a Ti-rich phase. The microactuator heat treated at 973 K showed the highest transformation temperature with the lowest transformation temperature hysteresis, which is attractive for high speed actuation.",

keywords = "Microactuator, Shape memory effect, Thin film, Ti-Ni-Cu",

author = "M. Tomozawa and Kim, {H. Y.} and A. Yamamoto and S. Hiromoto and S. Miyazaki",

year = "2010",

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doi = "10.1016/j.actamat.2010.07.024",

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AU - Tomozawa, M.

AU - Kim, H. Y.

AU - Yamamoto, A.

AU - Hiromoto, S.

AU - Miyazaki, S.

PY - 2010/10

Y1 - 2010/10

N2 - Ti-Ni-Cu/SiO2 two layer diaphragm-type microactuators were fabricated by sputter deposition and micromachining. The influence of heat treatment temperature on the actuation behavior was investigated under quasi-static conditions. The interfacial structure of Ti- Ni-Cu/SiO2 and internal structure of the Ti-Ni-Cu layer were also investigated using transmission electron microscopy. The reaction layer formed between the Ti-Ni-Cu and SiO2 layers, and preferentially grew into the SiO2 side. The reaction layer formed at 1023 K mainly consisted of Ti 4(Ni,Cu)2O. The maximum height of the diaphragm decreased with increasing heat treatment temperature. The growth of the reaction layer also affected the microstructure of the Ti-Ni-Cu layer. The density of fine platelets and Ti2Ni precipitates decreased with increasing heat treatment temperature from 873 to 923 K, and they disappeared at 973 K due to the fact that the reaction layer mainly consisted of a Ti-rich phase. The microactuator heat treated at 973 K showed the highest transformation temperature with the lowest transformation temperature hysteresis, which is attractive for high speed actuation.

AB - Ti-Ni-Cu/SiO2 two layer diaphragm-type microactuators were fabricated by sputter deposition and micromachining. The influence of heat treatment temperature on the actuation behavior was investigated under quasi-static conditions. The interfacial structure of Ti- Ni-Cu/SiO2 and internal structure of the Ti-Ni-Cu layer were also investigated using transmission electron microscopy. The reaction layer formed between the Ti-Ni-Cu and SiO2 layers, and preferentially grew into the SiO2 side. The reaction layer formed at 1023 K mainly consisted of Ti 4(Ni,Cu)2O. The maximum height of the diaphragm decreased with increasing heat treatment temperature. The growth of the reaction layer also affected the microstructure of the Ti-Ni-Cu layer. The density of fine platelets and Ti2Ni precipitates decreased with increasing heat treatment temperature from 873 to 923 K, and they disappeared at 973 K due to the fact that the reaction layer mainly consisted of a Ti-rich phase. The microactuator heat treated at 973 K showed the highest transformation temperature with the lowest transformation temperature hysteresis, which is attractive for high speed actuation.

KW - Microactuator

KW - Shape memory effect

KW - Thin film

KW - Ti-Ni-Cu

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Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti-Ni-Cu thin film microactuator

Abstract

Keywords

ASJC Scopus subject areas

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