Effect of microstructure on two-way shape memory effect in Cu-Al-Mn alloys

T. Omori, Y. Sutou, J. J. Wang, R. Kainuma, K. Ishida

Research output: Contribution to journalConference articlepeer-review

6 Citations (Scopus)


The shape memory effect (SME) and the two-way shape memory effect (TWME) of Cu-Al-Mn alloys induced by single bending deformation at room temperature were investigated in relation to the microstructural features of grain size and texture. It was found that the control of the texture and/or grain size significantly improves not only the SME, but also the TWME. Especially, the specimen with near {112}<102> texture obtained by cold-rolling and further recrystallization showed a high degree of TWME (εTWME = 3.6%) in the surface strain which is of the highest level of the TWME in the Cu-base shape memory alloys. It can be concluded that a high level of TWME in the bending deformation mode can be obtained from specimens with an excellent SME.

Original languageEnglish
Pages (from-to)507-510
Number of pages4
JournalJournal De Physique. IV : JP
Volume112 I
Publication statusPublished - 2003 Oct
EventInternational Conference on Martensitic Transformations - Espoo, Finland
Duration: 2002 Jun 102002 Jun 14


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