Abstract
Al/Cu dissimilar joining is a key technology for reducing the weight and cost of electrical components. In this study, the dissimilar friction stir lap welding (FSLW) of a Ni-containing Al alloy to pure Cu was performed, and the effects of the addition of Ni on the weld strength and interfacial microstructure were examined. A thin intermetallic compound (IMC) layer was observed at the Al/Cu weld interface produced by FSLW. The addition of 3 at.% Ni effectively improved the weld strength, although the thickness of the IMC layer increased. The IMC layer formed at the Al/Cu interface without Ni comprised CuAl2 and Cu9Al4 from the pure Al side. In contrast, the IMC layer formed with 3 at.% Ni consisted of (Ni,Cu)Al, CuAl, and Cu9Al4 from the Al side. The addition of Ni eliminated the weak CuAl2/Cu9Al4 interface, thereby improving the weld strength. The results of this study suggest that the strength of the Al/Cu weld can be effectively improved by the thinning of the IMC layer caused by FSLW and the change in interfacial microstructure caused by Ni addition.
Original language | English |
---|---|
Article number | 453 |
Journal | Metals |
Volume | 12 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2022 Mar |
Keywords
- Aluminum alloy
- Copper
- Dissimilar weld
- Friction stir weld
- Intermetallic compound
ASJC Scopus subject areas
- Materials Science(all)
- Metals and Alloys