Effect of prior cold-working on strength and electrical conductivity of Cu-Ti dilute alloy aged in a hydrogen atmosphere

Satoshi Semboshi, Hiroshi Numakura, Weilin Gao, Hisashi Suda, Akira Sugawara

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Citations (Scopus)

Abstract

Aging solution-treated Cu-Ti alloys in a hydrogen atmosphere significantly improved their electrical conductivity without degradation of the mechanical strength, compared to conventionally aged alloys. In this study, the influence of prior deformation on the mechanical and electrical properties of Cu-4.2 at.% Ti alloys aged in a hydrogen atmosphere was examined. The Vickers hardness of the solution-treated specimen increased from 127 kgf/mm2 to 265 kgf/mm2 by aging at 673 K for 180 h in a hydrogen atmosphere of 0.8 MPa, while that of the deformed specimen achieved a maximum of approximately 280 kgf/mm2 by aging for 100 h in the same atmosphere. Prior deformation resulted in a more rapid increase in conductivity during aging than that without deformation. The conductivity at the peak-hardness of the deformed specimen was 22% IACS (International Annealed Copper Standard), which exceeded that for the solution-treated specimen. Thus, prior deformation assisted in a significant improvement of the mechanical and electrical properties during aging in a hydrogen atmosphere.

Original languageEnglish
Title of host publicationPRICM7
PublisherTrans Tech Publications Ltd
Pages1315-1318
Number of pages4
ISBN (Print)0878492550, 9780878492558
DOIs
Publication statusPublished - 2010
Event7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7 - Cairns, QLD, Australia
Duration: 2010 Aug 22010 Aug 6

Publication series

NameMaterials Science Forum
Volume654-656
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
Country/TerritoryAustralia
CityCairns, QLD
Period10/8/210/8/6

Keywords

  • Aging
  • Cu alloy
  • Electrical conductivity
  • Hydrogen
  • Precipitation hardening
  • Strain

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