Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

Kohta Nakahira; Yuki Sato; Hiroki Kishi; Ken Suzuki; Hideo Miura

doi:10.1109/ESIME.2010.5464598

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

Kohta Nakahira, Yuki Sato, Hiroki Kishi, Ken Suzuki, Hideo Miura

Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local deformation of a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local deformation and residual stress in a chip using strain sensor chips and interference microscopy.

Original language	English
Title of host publication	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
DOIs	https://doi.org/10.1109/ESIME.2010.5464598
Publication status	Published - 2010
Event	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 - Bordeaux, France Duration: 2010 Apr 26 → 2010 Apr 28

Publication series

Name	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Conference

Conference	2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010
Country/Territory	France
City	Bordeaux
Period	10/4/26 → 10/4/28

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10.1109/ESIME.2010.5464598

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Nakahira, K., Sato, Y., Kishi, H., Suzuki, K., & Miura, H. (2010). Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures. In 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 Article 5464598 (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010). https://doi.org/10.1109/ESIME.2010.5464598

Nakahira, Kohta ; Sato, Yuki ; Kishi, Hiroki et al. / Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

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title = "Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures",

abstract = "Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local deformation of a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local deformation and residual stress in a chip using strain sensor chips and interference microscopy.",

author = "Kohta Nakahira and Yuki Sato and Hiroki Kishi and Ken Suzuki and Hideo Miura",

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doi = "10.1109/ESIME.2010.5464598",

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booktitle = "2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010",

note = "2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010 ; Conference date: 26-04-2010 Through 28-04-2010",

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Nakahira, K, Sato, Y, Kishi, H, Suzuki, K & Miura, H 2010, Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures. in 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010., 5464598, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, Bordeaux, France, 10/4/26. https://doi.org/10.1109/ESIME.2010.5464598

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures. / Nakahira, Kohta; Sato, Yuki; Kishi, Hiroki et al.
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464598 (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

AU - Nakahira, Kohta

AU - Sato, Yuki

AU - Kishi, Hiroki

AU - Suzuki, Ken

AU - Miura, Hideo

PY - 2010

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N2 - Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local deformation of a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local deformation and residual stress in a chip using strain sensor chips and interference microscopy.

AB - Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appear in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local deformation of a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local deformation and residual stress in a chip using strain sensor chips and interference microscopy.

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BT - 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

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Y2 - 26 April 2010 through 28 April 2010

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Nakahira K, Sato Y, Kishi H, Suzuki K , Miura H. Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures. In 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. 2010. 5464598. (2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010). doi: 10.1109/ESIME.2010.5464598

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures

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