Original language | English |
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Pages (from-to) | 164-168 |
Number of pages | 5 |
Journal | Journal of Japan Institute of Electronics Packaging |
Volume | 15 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2012 May |
Effective and low energy recycling method for solder paste
Takeshi Tanaka, Yozo Shimada, Hideyuki Takahashi, Kazuyuki Tohji
Research output: Contribution to journal › Article › peer-review
1
Citation
(Scopus)