TY - GEN
T1 - Effects of 3-D stacked vector cache on energy consumption
AU - Egawa, Ryusuke
AU - Funaya, Yusuke
AU - Nagaoka, Ryuichi
AU - Endo, Yusuke
AU - Musa, Akihiro
AU - Takizawa, Hiroyuki
AU - Kobayashi, Hiroaki
PY - 2011
Y1 - 2011
N2 - To realize a high computational efficiency, a 3-D stacked chip multi-vector processor (CMVP) has been proposed. However, the 3-D stacked CMVP has not been evaluated well in terms of energy consumption. Therefore, to clarify the potential of the 3-D stacked CMVP, this paper evaluates and analyzes the energy consumption of the 3-D stacked CMVP using real scientific applications. Especially, this paper focuses on the energy reduction effects given by a large scale vector cache, which can be realized by 3-D die stacking technologies. The evaluation results show the vector cache on the 3-D stacked CMVP has enough potential to achieve a low energy and high performance processing of the cutting edge scientific applications.
AB - To realize a high computational efficiency, a 3-D stacked chip multi-vector processor (CMVP) has been proposed. However, the 3-D stacked CMVP has not been evaluated well in terms of energy consumption. Therefore, to clarify the potential of the 3-D stacked CMVP, this paper evaluates and analyzes the energy consumption of the 3-D stacked CMVP using real scientific applications. Especially, this paper focuses on the energy reduction effects given by a large scale vector cache, which can be realized by 3-D die stacking technologies. The evaluation results show the vector cache on the 3-D stacked CMVP has enough potential to achieve a low energy and high performance processing of the cutting edge scientific applications.
UR - http://www.scopus.com/inward/record.url?scp=84866847272&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84866847272&partnerID=8YFLogxK
U2 - 10.1109/3DIC.2012.6263026
DO - 10.1109/3DIC.2012.6263026
M3 - Conference contribution
AN - SCOPUS:84866847272
SN - 9781467321891
T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Y2 - 31 January 2012 through 2 February 2012
ER -
