Effects of high-concentration phosphorus doping on crystal quality and lattice strain in SiGe HBTs

Katsuya Oda, Makoto Miura, Hiromi Shimamoto, Katsuyoshi Washio

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


A high-concentration in-situ phosphorus-doping technique for silicon low-temperature epitaxial growth with Si 2 H 6 has been developed. Growth temperature has an impact on the crystal quality and on lattice strain of phosphorus-doped silicon layers. Resistivity, micro-Raman spectroscopy, and high-resolution X-ray diffraction indicated that good crystal quality was achieved at a growth temperature of 525 °C. On the other hand, growth pressure has little influence on crystal quality or on lattice strain except for surface morphology. By optimizing epitaxial growth conditions, an extremely high concentration of phosphorous doping was achieved without a high-temperature activation annealing, and the resultant good crystal quality of the phosphorus-doped silicon layer gave a very low resistivity. Accordingly, the high-concentration in-situ phosphorus doping is a powerful technique to fabricate future ultra-high-speed SiGe HBTs.

Original languageEnglish
Pages (from-to)6017-6020
Number of pages4
JournalApplied Surface Science
Issue number19
Publication statusPublished - 2008 Jul 30
Externally publishedYes


  • Crystal quality
  • Lattice strain
  • Phosphorous doping
  • Rapid thermal UHV/CVD

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Physics and Astronomy(all)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films


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