TY - GEN
T1 - Electronic band-engineering of a dumbbell-shaped graphene nanoribbon by the application of uniaxial tensile strain
AU - Goundar, Jowesh Avisheik
AU - Zhang, Qinqiang
AU - Suzuki, Ken
AU - Miura, Hideo
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/5/12
Y1 - 2021/5/12
N2 - Graphene nanoribbons (GNRs) narrower than 70 nm are theoretically known to exhibit semiconductive properties, and thus, they were applied to photovoltaic devices with multi-band gap. A dumbbell-shape GNR (DSGNR) structure which consisted of a narrow semiconductive GNR and wide metallic GNRs at both ends was found to show no Schottky barrier around the interface between those GNRs and its effective bandgap varied under the application of uniaxial tensile strain. The photovoltaic properties of the DSGNR structures were validated by the area-arrayed 40-nm wide DSGNR structure on a silicon substrate and the large piezoresistive effect, in other words, large change of bandgap was also validated by the DSGNR transferred on a soft PDMS substrate.
AB - Graphene nanoribbons (GNRs) narrower than 70 nm are theoretically known to exhibit semiconductive properties, and thus, they were applied to photovoltaic devices with multi-band gap. A dumbbell-shape GNR (DSGNR) structure which consisted of a narrow semiconductive GNR and wide metallic GNRs at both ends was found to show no Schottky barrier around the interface between those GNRs and its effective bandgap varied under the application of uniaxial tensile strain. The photovoltaic properties of the DSGNR structures were validated by the area-arrayed 40-nm wide DSGNR structure on a silicon substrate and the large piezoresistive effect, in other words, large change of bandgap was also validated by the DSGNR transferred on a soft PDMS substrate.
KW - Band-engineering
KW - First principle DFT calculation
KW - Photosensitivity
KW - Uniaxial tensile strain
KW - graphene nanoribbon
UR - http://www.scopus.com/inward/record.url?scp=85113281926&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85113281926&partnerID=8YFLogxK
U2 - 10.23919/ICEP51988.2021.9451931
DO - 10.23919/ICEP51988.2021.9451931
M3 - Conference contribution
AN - SCOPUS:85113281926
T3 - 2021 International Conference on Electronics Packaging, ICEP 2021
SP - 147
EP - 148
BT - 2021 International Conference on Electronics Packaging, ICEP 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Electronics Packaging, ICEP 2021
Y2 - 12 May 2021 through 14 May 2021
ER -
