TY - JOUR
T1 - Enhanced UV imprint ability with a tri-layer stamp configuration
AU - Roy, E.
AU - Kanamori, Y.
AU - Belotti, M.
AU - Chen, Y.
N1 - Funding Information:
This work is supported the European Commission through IST Project No. 2001-37472 (Souvenir). The authors thank partners from AMO company (Aachen-Germany) and EVG tool provider (Schaerding-Austria) for useful discussion and collaborations.
PY - 2005/3
Y1 - 2005/3
N2 - Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.
AB - Soft imprinting lithography enhanced by a UV light (UV-SIL) takes advantages of both nanoimprint and soft lithography. Compared to the related techniques, the UV-SIL process uses single or multi-layer soft stamps and works at room temperature under low pressure (<0.5 bar). The advantage of using soft stamps relies on its conformable patterning over a large wafer area. In addition, the optical transparency of the stamps and the room temperature and low pressure imprint conditions make a high precision alignment achievable and the whole UV-SIL process compatible to the requirement of high-throughput production. In this work, we describe our recent achievements on the stamp fabrication, high resolution and large area imprinting. In particular, we demonstrate a reliable lift-off process which can be used for a wide range of applications.
KW - Nanofabrication
KW - Nanoimprint
KW - Pattern transfer
KW - Soft lithography
UR - http://www.scopus.com/inward/record.url?scp=14944339226&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=14944339226&partnerID=8YFLogxK
U2 - 10.1016/j.mee.2004.12.086
DO - 10.1016/j.mee.2004.12.086
M3 - Conference article
AN - SCOPUS:14944339226
SN - 0167-9317
VL - 78-79
SP - 689
EP - 694
JO - Microelectronic Engineering
JF - Microelectronic Engineering
IS - 1-4
T2 - Proceedings of the 30th International Conference on Micro- and Nano-Engineering
Y2 - 19 September 2004 through 22 September 2004
ER -