Abstract
The utilization of electromigration for enhancement of Al thin wire fabrication was investigated. The experimental sample was a passivated Al line with a square hole at the anode end, and wire fabrication was affected by both the thickness of the passivation layer and the side length of the hole. The optimum value of the passivation layer thickness was determined. Both the time to failure of the Al line and the length of formed wire increased with increasing thickness up to the optimum thickness. Wire fabrication was also enhanced by increasing the side length of the discharge hole.
| Original language | English |
|---|---|
| Pages (from-to) | 1219-1222 |
| Number of pages | 4 |
| Journal | Optoelectronics and Advanced Materials, Rapid Communications |
| Volume | 5 |
| Issue number | 11 |
| Publication status | Published - 2011 |
Keywords
- Adhesion
- Aluminum
- Electromigration
- Thin films