Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))

Hideharu Shimizu; Akihito Kumamoto; Kohei Shima; Yoshihiko Kobayashi; Takeshi Momose; Takeshi Nogami; Yukihiro Shimogaki

doi:10.1149/2.0061407jss

Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))

Hideharu Shimizu, Akihito Kumamoto, Kohei Shima, Yoshihiko Kobayashi, Takeshi Momose, Takeshi Nogami, Yukihiro Shimogaki

Research output: Contribution to journal › Comment/debate › peer-review

Original language	English
Pages (from-to)	X1-X2
Journal	ECS Journal of Solid State Science and Technology
Volume	3
Issue number	7
DOIs	https://doi.org/10.1149/2.0061407jss
Publication status	Published - 2014
Externally published	Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

Access to Document

10.1149/2.0061407jss

Cite this

Shimizu, H., Kumamoto, A., Shima, K., Kobayashi, Y., Momose, T., Nogami, T., & Shimogaki, Y. (2014). Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471)). ECS Journal of Solid State Science and Technology, 3(7), X1-X2. https://doi.org/10.1149/2.0061407jss

Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471)). / Shimizu, Hideharu; Kumamoto, Akihito; Shima, Kohei et al.
In: ECS Journal of Solid State Science and Technology, Vol. 3, No. 7, 2014, p. X1-X2.

Research output: Contribution to journal › Comment/debate › peer-review

Shimizu, H, Kumamoto, A, Shima, K, Kobayashi, Y, Momose, T, Nogami, T & Shimogaki, Y 2014, 'Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))', ECS Journal of Solid State Science and Technology, vol. 3, no. 7, pp. X1-X2. https://doi.org/10.1149/2.0061407jss

Shimizu H, Kumamoto A, Shima K, Kobayashi Y, Momose T, Nogami T et al. Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471)). ECS Journal of Solid State Science and Technology. 2014;3(7):X1-X2. doi: 10.1149/2.0061407jss

@article{14623702ab8446739d67dc8722bda43d,

title = "Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))",

author = "Hideharu Shimizu and Akihito Kumamoto and Kohei Shima and Yoshihiko Kobayashi and Takeshi Momose and Takeshi Nogami and Yukihiro Shimogaki",

year = "2014",

doi = "10.1149/2.0061407jss",

language = "English",

volume = "3",

pages = "X1--X2",

journal = "ECS Journal of Solid State Science and Technology",

issn = "2162-8769",

publisher = "Electrochemical Society, Inc.",

number = "7",

}

TY - JOUR

T1 - Erratum

T2 - Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))

AU - Shimizu, Hideharu

AU - Kumamoto, Akihito

AU - Shima, Kohei

AU - Kobayashi, Yoshihiko

AU - Momose, Takeshi

AU - Nogami, Takeshi

AU - Shimogaki, Yukihiro

PY - 2014

Y1 - 2014

UR - http://www.scopus.com/inward/record.url?scp=84903707745&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84903707745&partnerID=8YFLogxK

U2 - 10.1149/2.0061407jss

DO - 10.1149/2.0061407jss

M3 - Comment/debate

AN - SCOPUS:84903707745

SN - 2162-8769

VL - 3

SP - X1-X2

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

IS - 7

ER -

Erratum: Self-Assembled nano-Stuffing structure in CVD and ALD Co(W) films as a single-layered barrier/liner for future cu-interconnects (ECS Journal of Solid State Science and Technology (2013) 2 (P471))

ASJC Scopus subject areas

Access to Document

Other files and links

Cite this