Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature

T. Fukushima; E. Iwata; J. Bea; M. Murugesan; K. W. Lee; T. Tanaka; M. Koyanagi

doi:10.1109/3DIC.2010.5751436

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature

T. Fukushima, E. Iwata, J. Bea, M. Murugesan, K. W. Lee, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

14 Citations (Scopus)

Abstract

Chip-to-wafer bonding is a promising technology for 3D integration due to high production yield using known good dies (KGDs). However, conventional chip-to-wafer 3D integration lowers production throughput because pick-and-place chip assembly is employed. To overcome the problem, we proposed a new chip-to-wafer 3D integration using self-assembly by which many KGDs can be simultaneously, rapidly, and precisely aligned and tightly bonded on wafers. The driving force is liquid surface tension. Here, we used an aqueous solution including dilute HF. In this paper, we discuss the dependence of alignment accuracy on several parameters in self-assembly conditions. In addition, we describe mechanism on HF-assisted direct chip bonding to wafers without thermal compression.

Original language	English
Title of host publication	IEEE 3D System Integration Conference 2010, 3DIC 2010
DOIs	https://doi.org/10.1109/3DIC.2010.5751436
Publication status	Published - 2010 Dec 1
Event	2nd IEEE International 3D System Integration Conference, 3DIC 2010 - Munich, Germany Duration: 2010 Nov 16 → 2010 Nov 18

Publication series

Name	IEEE 3D System Integration Conference 2010, 3DIC 2010

Other

Other	2nd IEEE International 3D System Integration Conference, 3DIC 2010
Country/Territory	Germany
City	Munich
Period	10/11/16 → 10/11/18

ASJC Scopus subject areas

Control and Systems Engineering

Access to Document

10.1109/3DIC.2010.5751436

Cite this

Fukushima, T., Iwata, E., Bea, J., Murugesan, M., Lee, K. W., Tanaka, T., & Koyanagi, M. (2010). Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. In IEEE 3D System Integration Conference 2010, 3DIC 2010 [5751436] (IEEE 3D System Integration Conference 2010, 3DIC 2010). https://doi.org/10.1109/3DIC.2010.5751436

Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. / Fukushima, T.; Iwata, E.; Bea, J. et al.
IEEE 3D System Integration Conference 2010, 3DIC 2010. 2010. 5751436 (IEEE 3D System Integration Conference 2010, 3DIC 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fukushima, T, Iwata, E, Bea, J, Murugesan, M, Lee, KW, Tanaka, T & Koyanagi, M 2010, Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. in IEEE 3D System Integration Conference 2010, 3DIC 2010., 5751436, IEEE 3D System Integration Conference 2010, 3DIC 2010, 2nd IEEE International 3D System Integration Conference, 3DIC 2010, Munich, Germany, 10/11/16. https://doi.org/10.1109/3DIC.2010.5751436

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AU - Tanaka, T.

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Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature

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