TY - GEN
T1 - Evaluation of Ground Slipperiness during Collision Using MEMS Local Slip Sensor
AU - Okatani, Taiyu
AU - Shimoyama, Isao
N1 - Funding Information:
The photolithography masks were made using the University of Tokyo VLSI Design and Education Center (VDEC)’s 8 inch EB writer F5112 + VD01 donated by ADVANTEST Corporation. This work was supported by JSPS KAKENHI Grant Number 18J14114.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/1
Y1 - 2019/1
N2 - In this paper, we propose a method to evaluate slipperiness of a place where a foot of a legged robot collides. This method will enable the robot to prevent a slip even if the slipperiness is unexpected, whereas conventional robots have no choice but to presume the slipperiness. We show a MEMS local slip sensor is applicable to not only static situations but also dynamic situations like collision. We tested the sensor by dropping it vertically against three types of surfaces which varied in slipperiness. The results show the three surfaces can be distinguished during the collision by monitoring the sensor response.
AB - In this paper, we propose a method to evaluate slipperiness of a place where a foot of a legged robot collides. This method will enable the robot to prevent a slip even if the slipperiness is unexpected, whereas conventional robots have no choice but to presume the slipperiness. We show a MEMS local slip sensor is applicable to not only static situations but also dynamic situations like collision. We tested the sensor by dropping it vertically against three types of surfaces which varied in slipperiness. The results show the three surfaces can be distinguished during the collision by monitoring the sensor response.
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U2 - 10.1109/MEMSYS.2019.8870701
DO - 10.1109/MEMSYS.2019.8870701
M3 - Conference contribution
AN - SCOPUS:85074349523
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 823
EP - 825
BT - 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
Y2 - 27 January 2019 through 31 January 2019
ER -