Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Original language	English
Pages (from-to)	427-432
Number of pages	6
Journal	Journal of Japan Institute of Electronics Packaging
Volume	10
Issue number	5
DOIs	https://doi.org/10.5104/jiep.10.427
Publication status	Published - 2007

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@article{40f1396119b8402abd7911505e605e9a,

title = "Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis",

author = "Hideo Miura",

year = "2007",

doi = "10.5104/jiep.10.427",

language = "English",

volume = "10",

pages = "427--432",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "5",

}

TY - JOUR

T1 - Evaluation of Strength and Reliability of Electronic Packages and Modules Based on Structural Analysis

AU - Miura, Hideo

PY - 2007

Y1 - 2007

UR - http://www.scopus.com/inward/record.url?scp=85006005339&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85006005339&partnerID=8YFLogxK

U2 - 10.5104/jiep.10.427

DO - 10.5104/jiep.10.427

M3 - Article

AN - SCOPUS:85006005339

SN - 1343-9677

VL - 10

SP - 427

EP - 432

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

IS - 5

ER -