Excellent scalability including self-heating phenomena of vertical-channel field-effect-diode type capacitor-less one transistor dynamic random access memory cell

The scalability study and the impact of the self-heating effect (SHE) on memory operation of the bulk vertical-channel field effect diode (FED) type capacitorless one transistor (1T) dynamic random access memory (DRAM) cell are investigated via device simulator for the first time. The verticalchannel FED type 1T-DRAM cell shows the excellent hold characteristics (100ms at 358K of ambient temperature) with large enough read current margin (1 μA/cell) even when silicon pillar diameter (D) is scaled down from 20 to 12 nm. It is also shown that by employing the vertical-channel FED type, maximum lattice temperature in the memory cell due to SHE (T^Max_L ) can be suppressed to a negligible small value and only reach 300.6 from 300K ambient temperature due to the low lateral electric field, while the vertical-channel bipolar junction transistor (BJT) type 1T-DRAM shows significant SHE (T ^Max_L= 330:6 K). Moreover, this excellent thermal characteristic can be maintained even when D is scaled down from 20 to 12 nm.