TY - GEN
T1 - Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip
AU - Shimokawa, Kenji
AU - Qian, Zhengyang
AU - Takezawa, Yoshiki
AU - Kino, Hisashi
AU - Fukushima, Takafumi
AU - Kiyoyama, Koji
AU - Tanaka, Tetsu
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by JSPS KAKENHI Grant Number 15H01812. This work was partially supported by VDEC collaboration with Cadence Design Systems, Inc., Synopsys Inc., and Mentor Graphics Inc.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - To restore visual sensation of blind patients suffering from age-related macular degeneration (AMD) and retinitis pigmentosa (RP), we have been developing fully-implantable retinal prosthesis consisting of three dimensional (3-D) stacked retinal prosthesis chip with high density through silicon vias (TSVs), flexible cable, and a stimulus electrode array. Using 3-D integration technology, a photoreceptor chip with more than 1000 pixels can be fabricated in the top layer, and stimulus current generator with various image processing functions can also be fabricated in the bottom layer. In this paper, we presented experimental evaluation results of the stimulus current generator with Laplacian edge-enhancement function. The proposed edge enhancement (EE) function used a four-neighbor Laplacian filter circuit as analog signal processing and was implemented in a 0.18-μm 1P6M CMOS technology. A pixel size including the four-neighbor Laplacian filter circuit was 75 × 75 μm2, and 37 × 37 pixels occupied a very small active circuit area of 3.2 × 3.2 mm2. Experimental results showed the fabricated stimulus current generator completely captured an input image and successfully performed the EE processing for the input image data. Furthermore, total output current from photo-diodes, which became input currents of biphasic pulse generator, was reduced by 87% with the EE circuit. Safer electrical stimulations to the retina cells can be realized with the stimulus current generator with Laplacian EE in the 3-D stacked retinal prosthesis chip.
AB - To restore visual sensation of blind patients suffering from age-related macular degeneration (AMD) and retinitis pigmentosa (RP), we have been developing fully-implantable retinal prosthesis consisting of three dimensional (3-D) stacked retinal prosthesis chip with high density through silicon vias (TSVs), flexible cable, and a stimulus electrode array. Using 3-D integration technology, a photoreceptor chip with more than 1000 pixels can be fabricated in the top layer, and stimulus current generator with various image processing functions can also be fabricated in the bottom layer. In this paper, we presented experimental evaluation results of the stimulus current generator with Laplacian edge-enhancement function. The proposed edge enhancement (EE) function used a four-neighbor Laplacian filter circuit as analog signal processing and was implemented in a 0.18-μm 1P6M CMOS technology. A pixel size including the four-neighbor Laplacian filter circuit was 75 × 75 μm2, and 37 × 37 pixels occupied a very small active circuit area of 3.2 × 3.2 mm2. Experimental results showed the fabricated stimulus current generator completely captured an input image and successfully performed the EE processing for the input image data. Furthermore, total output current from photo-diodes, which became input currents of biphasic pulse generator, was reduced by 87% with the EE circuit. Safer electrical stimulations to the retina cells can be realized with the stimulus current generator with Laplacian EE in the 3-D stacked retinal prosthesis chip.
KW - biphasic stimulus current generator
KW - edge enhancement
KW - four-neighbor Laplacian filter
KW - retinal prosthesis
UR - http://www.scopus.com/inward/record.url?scp=85049966978&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85049966978&partnerID=8YFLogxK
U2 - 10.1109/BIOCAS.2017.8325552
DO - 10.1109/BIOCAS.2017.8325552
M3 - Conference contribution
AN - SCOPUS:85049966978
T3 - 2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings
SP - 1
EP - 4
BT - 2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Biomedical Circuits and Systems Conference, BioCAS 2017
Y2 - 19 October 2017 through 21 October 2017
ER -