TY - GEN
T1 - Experiments on relationship between electromagnetic noise and surface profile change by arc discharge of heterogeneous material contacts
AU - Ebara, Yasuo
AU - Koizumi, Toshiaki
AU - Sone, Hideaki
AU - Nemoto, Yoshiaki
N1 - Publisher Copyright:
© 1999 IEEE.
PY - 1999
Y1 - 1999
N2 - The authors have observed a relationship between the waveforms of electromagnetic noise and a change of surface for arc discharges of opening Cu-C and Ag-Pd material electric contacts. In the case of Cu-C electrodes, the waveforms of electromagnetic noise and the changes of the electrode surface are affected by electric current polarity. By classification of the noise waveform pattern, the authors showed a close relationship between noise and change of surface. The noise level of Pd(anode)-Ag(cathode) increases in the middle of arc duration, and decreases in the latter half. In high noise level conditions, a change of color on the surfaces of both electrodes was found for Pd(anode)-Ag(cathode). The pattern of noise occurrence depends mainly on the cathode material.
AB - The authors have observed a relationship between the waveforms of electromagnetic noise and a change of surface for arc discharges of opening Cu-C and Ag-Pd material electric contacts. In the case of Cu-C electrodes, the waveforms of electromagnetic noise and the changes of the electrode surface are affected by electric current polarity. By classification of the noise waveform pattern, the authors showed a close relationship between noise and change of surface. The noise level of Pd(anode)-Ag(cathode) increases in the middle of arc duration, and decreases in the latter half. In high noise level conditions, a change of color on the surfaces of both electrodes was found for Pd(anode)-Ag(cathode). The pattern of noise occurrence depends mainly on the cathode material.
UR - http://www.scopus.com/inward/record.url?scp=0033309898&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0033309898&partnerID=8YFLogxK
U2 - 10.1109/ISEMC.1999.812888
DO - 10.1109/ISEMC.1999.812888
M3 - Conference contribution
AN - SCOPUS:0033309898
T3 - IEEE International Symposium on Electromagnetic Compatibility
SP - 165
EP - 170
BT - IEEE International Symposium on Electromagnetic Compatibility
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1999 IEEE International Symposium on Electromagnetic Compatibility, EMC 1999
Y2 - 2 August 1999 through 6 August 1999
ER -