TY - GEN
T1 - Extremely flexible (1mm Bending Radius) biocompatible heterogeneous fan-out wafer-level platform with the lowest reported die-shift (<6 μm) and reliable flexible cu-based interconnects
AU - Hanna, Amir
AU - Alam, Arsalan
AU - Fukushima, Takafumi
AU - Moran, Steven
AU - Whitehead, William
AU - Jangam, Siva Chandra
AU - Pal, Saptadeep
AU - Ezhilarasu, Goutham
AU - Irwin, Randall
AU - Bajwa, Adeel
AU - Iyer, Subramanian
N1 - Funding Information:
This work was partially funded DARPA/ONR (grant 00014-16-1-263), and NBMC (Air Force Research Laboratory under agreement number FA8650-13-2-7311). We also acknowledge the partial support of UCLA CHIPS consortium, I3 electronics and Second Sight companies. The authors gratefully acknowledge the support of Global INTegration Initiative (GINTI) in Tohoku University, Japan. We also would like to acknowledge Dow Corning and NITTO for their material support and cyberTECHNOLOGIES for their measurement support.
Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/7
Y1 - 2018/8/7
N2 - A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble >600 dies with co-planarity and tilt <1μm, average die-shift of 3.28 μm with ? < 2.23 μm. We have also engineered a novel corrugated topography of a stress buffer layer for metal interconnects on FlexTrateTM to mitigate the buckling phenomenon of metal films deposited on elastomeric substrates. Corrugated interconnects were then tested for their mechanical bending reliability and have shown less than 0.4% change in resistance after bending at 1 mm radius for 1,000 cycles. Finally, we demonstrate integration of an array of 25 dielets interconnected in a daisy chain configuration at 40 μm interconnect pitch.
AB - A flexible fan-out wafer-level packaging (FOWLP) process for heterogeneous integration of high performance dies in a flexible and biocompatible elastomeric package (FlexTrateTM) was used to assemble >600 dies with co-planarity and tilt <1μm, average die-shift of 3.28 μm with ? < 2.23 μm. We have also engineered a novel corrugated topography of a stress buffer layer for metal interconnects on FlexTrateTM to mitigate the buckling phenomenon of metal films deposited on elastomeric substrates. Corrugated interconnects were then tested for their mechanical bending reliability and have shown less than 0.4% change in resistance after bending at 1 mm radius for 1,000 cycles. Finally, we demonstrate integration of an array of 25 dielets interconnected in a daisy chain configuration at 40 μm interconnect pitch.
KW - Bendable interconnect
KW - Biocompatible
KW - FOWLP
KW - Flexible device integration
KW - Metallization of PDMS
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U2 - 10.1109/ECTC.2018.00229
DO - 10.1109/ECTC.2018.00229
M3 - Conference contribution
AN - SCOPUS:85051950484
SN - 9781538649985
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1505
EP - 1511
BT - Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE Electronic Components and Technology Conference, ECTC 2018
Y2 - 29 May 2018 through 1 June 2018
ER -