Extremely flexible (1mm Bending Radius) biocompatible heterogeneous fan-out wafer-level platform with the lowest reported die-shift (<6 μm) and reliable flexible cu-based interconnects

Amir Hanna, Arsalan Alam, Takafumi Fukushima, Steven Moran, William Whitehead, Siva Chandra Jangam, Saptadeep Pal, Goutham Ezhilarasu, Randall Irwin, Adeel Bajwa, Subramanian Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

22 Citations (Scopus)

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