TY - GEN
T1 - Fabrication and characterization of 3D fin-channel MANOS type flash memory
AU - Liu, Y. X.
AU - Nabatame, T.
AU - Matsukawa, T.
AU - Endo, K.
AU - O'Uchi, S.
AU - Tsukada, J.
AU - Yamauchi, H.
AU - Ishikawa, Y.
AU - Mizubayashi, W.
AU - Morita, Y.
AU - Migita, S.
AU - Ota, H.
AU - Chikyow, T.
AU - Masahara, M.
N1 - Funding Information:
This work was supported in part by the Nanotechnology Project of NEDO Japan.
Publisher Copyright:
© 2014 IEEE.
PY - 2015/12/4
Y1 - 2015/12/4
N2 - The 3D fin-channel charge-trapping (CT) type flash memories with a high-k Al2O3 blocking layer (MANOS) have successfully been fabricated by scaling down Lg to 22 nm, and their electrical characteristics including variability of threshold voltage (Vt), endurance and retention characteristics have systematically been investigated. Thanks to the high-k effect of an Al2O3 blocking layer, it was found that the better short-channel effect (SCE) immunity and a larger memory window are obtained in the fabricated MANOS type flash memories than the MONOS ones with a SiO2 blocking layer.
AB - The 3D fin-channel charge-trapping (CT) type flash memories with a high-k Al2O3 blocking layer (MANOS) have successfully been fabricated by scaling down Lg to 22 nm, and their electrical characteristics including variability of threshold voltage (Vt), endurance and retention characteristics have systematically been investigated. Thanks to the high-k effect of an Al2O3 blocking layer, it was found that the better short-channel effect (SCE) immunity and a larger memory window are obtained in the fabricated MANOS type flash memories than the MONOS ones with a SiO2 blocking layer.
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U2 - 10.1109/SNW.2014.7348559
DO - 10.1109/SNW.2014.7348559
M3 - Conference contribution
AN - SCOPUS:84963863777
T3 - 2014 Silicon Nanoelectronics Workshop, SNW 2014
BT - 2014 Silicon Nanoelectronics Workshop, SNW 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Silicon Nanoelectronics Workshop, SNW 2014
Y2 - 8 June 2014 through 9 June 2014
ER -