TY - GEN
T1 - Fabrication and evaluation of silicon micromechanical resonator using neutral beam etching technology
AU - Van Toan, Nguyen
AU - Kubota, Tomohiro
AU - Seknar, Halubai
AU - Samukawa, Seiji
AU - Ono, Takahito
PY - 2014/9/23
Y1 - 2014/9/23
N2 - We present the fabrication and evaluation of silicon micromechanical resonators fabricated by neutral beam etching (NBE) to obtain narrow capacitive gap size for small motional resistance and low insertion loss. The resonant frequency of the fabricated devices with a length of 500 μm, width of 440 μm and thickness of 5 μm is 9.66 MHz, and the average quality factor (Q) value is around 78,000. The devices fabricated by both deep reactive ion etching (DRIE) and NBE are evaluated and compared. The devices fabricated by NBE show that the motional resistances are reduced by almost 11 times from 645 kΩ to 59 kΩ and their output signals (insertion loss) are increased by approximately 15 dB in comparison with those fabricated by DRIE.
AB - We present the fabrication and evaluation of silicon micromechanical resonators fabricated by neutral beam etching (NBE) to obtain narrow capacitive gap size for small motional resistance and low insertion loss. The resonant frequency of the fabricated devices with a length of 500 μm, width of 440 μm and thickness of 5 μm is 9.66 MHz, and the average quality factor (Q) value is around 78,000. The devices fabricated by both deep reactive ion etching (DRIE) and NBE are evaluated and compared. The devices fabricated by NBE show that the motional resistances are reduced by almost 11 times from 645 kΩ to 59 kΩ and their output signals (insertion loss) are increased by approximately 15 dB in comparison with those fabricated by DRIE.
KW - Silicon micromechanical resonator
KW - deep reactive ion etching
KW - low temperature co-fired ceramic
KW - neutral beam etching technology
KW - silicon on insulator
UR - http://www.scopus.com/inward/record.url?scp=84908626108&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84908626108&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2014.6908747
DO - 10.1109/NEMS.2014.6908747
M3 - Conference contribution
AN - SCOPUS:84908626108
T3 - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
SP - 1
EP - 5
BT - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
Y2 - 13 April 2014 through 16 April 2014
ER -