Fabrication and evaluation of three-dimensional optically coupled common memory

Kouji Miyake; Tohru Namba; Kenji Hashimoto; Hiroyuki Sakaue; Seiichi Miyazaki; Yasuhiro Horiike; Shin Yokoyama; Mitsumasa Koyanagi; Masataka Hirose

doi:10.1143/JJAP.34.1246

Fabrication and evaluation of three-dimensional optically coupled common memory

Kouji Miyake, Tohru Namba, Kenji Hashimoto, Hiroyuki Sakaue, Seiichi Miyazaki, Yasuhiro Horiike, Shin Yokoyama, Mitsumasa Koyanagi, Masataka Hirose

Research output: Contribution to journal › Article › peer-review

Abstract

A three-dimensional optically coupled common memory (3D-OCC memory) test chip, on which GaAs LEDs are integrated using the microbonding technique, has been fabricated using a 2 μm complementary metal-oxide-semiconductor (CMOS) technology. Static memory cell circuits with photodiodes were formed on the chip. Optical writing and electrical reading operations of the 3D-OCC memory test chip have been demonstrated.

Original language	English
Pages (from-to)	1246-1248
Number of pages	3
Journal	Japanese journal of applied physics
Volume	34
Issue number	2S
DOIs	https://doi.org/10.1143/JJAP.34.1246
Publication status	Published - 1995 Feb
Externally published	Yes

Keywords

Common memory
LED
Microbond ing
Optical coupling
Optical writing
Parallel processing
Photodiode
Three-dimensional 1C

ASJC Scopus subject areas

Engineering(all)
Physics and Astronomy(all)

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10.1143/JJAP.34.1246

Cite this

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title = "Fabrication and evaluation of three-dimensional optically coupled common memory",

abstract = "A three-dimensional optically coupled common memory (3D-OCC memory) test chip, on which GaAs LEDs are integrated using the microbonding technique, has been fabricated using a 2 μm complementary metal-oxide-semiconductor (CMOS) technology. Static memory cell circuits with photodiodes were formed on the chip. Optical writing and electrical reading operations of the 3D-OCC memory test chip have been demonstrated.",

keywords = "Common memory, LED, Microbond ing, Optical coupling, Optical writing, Parallel processing, Photodiode, Three-dimensional 1C",

author = "Kouji Miyake and Tohru Namba and Kenji Hashimoto and Hiroyuki Sakaue and Seiichi Miyazaki and Yasuhiro Horiike and Shin Yokoyama and Mitsumasa Koyanagi and Masataka Hirose",

year = "1995",

month = feb,

doi = "10.1143/JJAP.34.1246",

language = "English",

volume = "34",

pages = "1246--1248",

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T1 - Fabrication and evaluation of three-dimensional optically coupled common memory

AU - Miyake, Kouji

AU - Namba, Tohru

AU - Hashimoto, Kenji

AU - Sakaue, Hiroyuki

AU - Miyazaki, Seiichi

AU - Horiike, Yasuhiro

AU - Yokoyama, Shin

AU - Koyanagi, Mitsumasa

AU - Hirose, Masataka

PY - 1995/2

Y1 - 1995/2

N2 - A three-dimensional optically coupled common memory (3D-OCC memory) test chip, on which GaAs LEDs are integrated using the microbonding technique, has been fabricated using a 2 μm complementary metal-oxide-semiconductor (CMOS) technology. Static memory cell circuits with photodiodes were formed on the chip. Optical writing and electrical reading operations of the 3D-OCC memory test chip have been demonstrated.

AB - A three-dimensional optically coupled common memory (3D-OCC memory) test chip, on which GaAs LEDs are integrated using the microbonding technique, has been fabricated using a 2 μm complementary metal-oxide-semiconductor (CMOS) technology. Static memory cell circuits with photodiodes were formed on the chip. Optical writing and electrical reading operations of the 3D-OCC memory test chip have been demonstrated.

KW - Common memory

KW - LED

KW - Microbond ing

KW - Optical coupling

KW - Optical writing

KW - Parallel processing

KW - Photodiode

KW - Three-dimensional 1C

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JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

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Fabrication and evaluation of three-dimensional optically coupled common memory

Abstract

Keywords

ASJC Scopus subject areas

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