Fabrication and evaluation of three-dimensional optically coupled common memory

Kouji Miyake, Tohru Namba, Kenji Hashimoto, Hiroyuki Sakaue, Seiichi Miyazaki, Yasuhiro Horiike, Shin Yokoyama, Mitsumasa Koyanagi, Masataka Hirose

Research output: Contribution to journalArticlepeer-review


A three-dimensional optically coupled common memory (3D-OCC memory) test chip, on which GaAs LEDs are integrated using the microbonding technique, has been fabricated using a 2 μm complementary metal-oxide-semiconductor (CMOS) technology. Static memory cell circuits with photodiodes were formed on the chip. Optical writing and electrical reading operations of the 3D-OCC memory test chip have been demonstrated.

Original languageEnglish
Pages (from-to)1246-1248
Number of pages3
JournalJapanese journal of applied physics
Issue number2S
Publication statusPublished - 1995 Feb
Externally publishedYes


  • Common memory
  • LED
  • Microbond ing
  • Optical coupling
  • Optical writing
  • Parallel processing
  • Photodiode
  • Three-dimensional 1C

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)


Dive into the research topics of 'Fabrication and evaluation of three-dimensional optically coupled common memory'. Together they form a unique fingerprint.

Cite this