Fabrication methods for high aspect ratio microstructures

Satori Watanabe, Masayoshi Esashi, Yoshio Yamashita

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


Two methods for fabricating high aspect ratio (depth/width) microstructures were developed and compared. The first method is a modified deep X-ray lithography process with thick negative resist. For preventing pattern collapse caused by surface tension while the rinse liquid is evaporated, some post-rinse drying processes were investigated. The second method is a directional etching of polyimide by O2 reactive ion etching (RIE). The advantage of the latter method is that the surface tension of liquids does not affect the microstructure in a dry atmosphere. In both methods, aspect ratio of 10 was achieved in polymer molds for electroplating at pattern width of 5 μm without collapse.

Original languageEnglish
Pages (from-to)173-176
Number of pages4
JournalJournal of Intelligent Material Systems and Structures
Issue number2
Publication statusPublished - 1997 Feb

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanical Engineering


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