Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies

Tim Schroeder; Joerg Froemel; Shuji Tanaka; Thomas Gessner

doi:10.1109/NEMS.2016.7758277

Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies

Tim Schroeder, Joerg Froemel, Shuji Tanaka, Thomas Gessner

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

For the further miniaturization of integrated circuits, the integration of passive components on the chip is one approach. In DC-DC converter applications, the integration of the inductor with high inductivity is one problem. This paper addresses this problem by proposing a new technique for fabricating a multilayer spiral coil that is also useful as part of electromagnetic MEMS (Micro-Electro-Mechanical Systems) actuators. The multilayer coil is made by stacking separately fabricated coil layers and joining them with a selective bonding and debonding technique.

Original language	English
Title of host publication	2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	401-404
Number of pages	4
ISBN (Electronic)	9781509019472
DOIs	https://doi.org/10.1109/NEMS.2016.7758277
Publication status	Published - 2016 Nov 28
Event	11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan Duration: 2016 Apr 17 → 2016 Apr 20

Publication series

Name	2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016

Other

Other	11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
Country/Territory	Japan
City	Sendai
Period	16/4/17 → 16/4/20

Keywords

VLSI
die-to-wafer bonding
monolithic DC-DC converter
multilayer inductor
selective debonding

ASJC Scopus subject areas

Industrial and Manufacturing Engineering
Mechanical Engineering
Mechanics of Materials
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/NEMS.2016.7758277

Cite this

Schroeder, T., Froemel, J., Tanaka, S., & Gessner, T. (2016). Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies. In 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 (pp. 401-404). [7758277] (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2016.7758277

Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies. / Schroeder, Tim; Froemel, Joerg ; Tanaka, Shuji et al.
2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 401-404 7758277 (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Schroeder, T, Froemel, J , Tanaka, S & Gessner, T 2016, Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies. in 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016., 7758277, 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Institute of Electrical and Electronics Engineers Inc., pp. 401-404, 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016, Sendai, Japan, 16/4/17. https://doi.org/10.1109/NEMS.2016.7758277

Schroeder T, Froemel J , Tanaka S, Gessner T. Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies. In 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 401-404. 7758277. (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016). doi: 10.1109/NEMS.2016.7758277

Schroeder, Tim ; Froemel, Joerg ; Tanaka, Shuji et al. / Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies. 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 401-404 (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016).

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abstract = "For the further miniaturization of integrated circuits, the integration of passive components on the chip is one approach. In DC-DC converter applications, the integration of the inductor with high inductivity is one problem. This paper addresses this problem by proposing a new technique for fabricating a multilayer spiral coil that is also useful as part of electromagnetic MEMS (Micro-Electro-Mechanical Systems) actuators. The multilayer coil is made by stacking separately fabricated coil layers and joining them with a selective bonding and debonding technique.",

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Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies

Abstract

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Keywords

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