Fabrication of an hermetically packaged silicon resonator on LTCC substrate

Nguyen Van Toan, Hidetoshi Miyashita, Masaya Toda, Yusuke Kawai, Takahito Ono

Research output: Contribution to journalArticlepeer-review

30 Citations (Scopus)


The design, fabrication and packaging process of silicon resonators capable of the integration of LSI (Large Scale Integration) have been developed on the basis of packaging technology using an LTCC (Low Temperature Co-fired Ceramic) substrate. The structures of silicon resonators are defined by deep reactive ion etching (DRIE) on a silicon on insulator (SOI) wafer and then transferred onto the LTCC substrate and hermetically sealed by anodic bonding technique. The measured resonant frequency of a micromechanical bulk acoustic mode silicon resonator after packaging at 0.02 Pa is 20.24 MHz with a quality factor of 50,600.

Original languageEnglish
Pages (from-to)1165-1175
Number of pages11
JournalMicrosystem Technologies
Issue number8
Publication statusPublished - 2013 Aug


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