@inproceedings{b526fd00011848d98687ff99fa1205ab,
title = "Fabrication of capacitive micromachined ultrasonic transducer arrays using glass reflow process and anodic bonding",
abstract = "This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. The silicon through-wafer interconnects have been investigated by glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5×5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 μm and sensing gap of 3.2 um (distance between top and bottom electrodes) is observed at 2.83 MHz. The Q factor is approximately 1300 at vacuum chamber pressure of 0.01 Pa.",
keywords = "Anodic bonding, Capacitive micromachined ultrasonic transducer, Chemical sensing, Glass reflow process, Medical imaging, Non-destructive measurement",
author = "Toan, {N. V.} and S. Hahng and Yunheub Song and T. Ono",
year = "2016",
language = "English",
series = "Advanced Materials - TechConnect Briefs 2016",
publisher = "TechConnect",
pages = "91--94",
editor = "Bart Romanowicz and Matthew Laudon and Fiona Case and Fiona Case and Bart Romanowicz",
booktitle = "Advanced Manufacturing, Electronics and Microsystems - TechConnect Briefs 2016",
note = "10th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 19th Annual Nanotech Conference and Expo, and the 2016 National SBIR/STTR Conference ; Conference date: 22-05-2016 Through 25-05-2016",
}