Fabrication of microprobes on a ultrathick glass substrate with narrow-pitch electrical feedthroughs for next-generation LSI burn-in tests

This paper describes microprobes fabricated on a thick glass substrate with narrow-pitch electrical feedthroughs for the application to the next-generation LSI burn-in test. The feedthrough glass substrate was sliced off from the block of stacked Pyrex glass substrates with thin metal lines. The pitch of the feedthroughs in one direction is defined by photolithography, and thus can be made sufficiently small. The probes were made of heavily-boron-diffused silicon, and fixed on the feedthrough glass substrate by anodic bonding. The feedthrough glass substrate was evaluated in terms of the resistance of the feedthroughs. The probes were evaluated in terms of mechanical robustness against overdrive.