Fabrication of miniaturized bi-convex quartz crystal microbalance using reactive ion etching and melting photoresist

Li Li, Takashi Abe, Masayoshi Esashi

Research output: Contribution to journalConference articlepeer-review

23 Citations (Scopus)

Abstract

In this paper, miniaturized bi-convex quartz crystal microbalance (QCM) has been fabricated using reactive ion etching (RIE) and melting photoresist technology. Due to the convexity of the resonator surface and the small size of the excitation electrode, the energy of the oscillation is trapped at the center so that very little dissipation occurs at the edge. The fabricated bi-convex QCM has superior resonant characteristics compared with a QCM without the bi-convex formation. For example, the QCM with a high-quality value (76000) was realized for a 1mm-diameter electrode QCM with 1.6μm-deep and 2mm-diameter convex formation on both sides. A spurious mode around a fundamental vibration mode became very small or nearly negligible. This technology is useful from the viewpoint of mass production because it does not require polishing. The manufactured bi-convex QCM can be used for sensing liquid properties.

Original languageEnglish
Pages (from-to)496-500
Number of pages5
JournalSensors and Actuators, A: Physical
Volume114
Issue number2-3
DOIs
Publication statusPublished - 2004 Sept 1
Externally publishedYes
EventSelected Papers from Transducers 03 - Boston, MA, United States
Duration: 2003 Jun 82003 Jun 12

Keywords

  • Bi-convex
  • Melting photoresist technology
  • Q-factor
  • Quartz crystal microbalance (QCM)
  • Reactive ion etching (RIE)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Fabrication of miniaturized bi-convex quartz crystal microbalance using reactive ion etching and melting photoresist'. Together they form a unique fingerprint.

Cite this