Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

So Ikeda, Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Toshiaki Oguchi

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.

Original languageEnglish
Title of host publicationProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PublisherIEEE Computer Society
Pages36
Number of pages1
ISBN (Print)9781479952618
DOIs
Publication statusPublished - 2014
Event2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
Duration: 2014 Jul 152014 Jul 16

Publication series

NameProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Conference

Conference2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country/TerritoryJapan
CityTokyo
Period14/7/1514/7/16

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