FEM simulation of nodulation in copper electro-refining

Ken Adachi; Yuya Nakai; Atsushi Kitada; Kazuhiro Fukami; Kuniaki Murase

doi:10.1007/978-3-319-72350-1_20

FEM simulation of nodulation in copper electro-refining

Ken Adachi, Yuya Nakai, Atsushi Kitada, Kazuhiro Fukami, Kuniaki Murase

IMRAM - Center for Mineral Processing and Metallurgy (CMPM)

Kyoto University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Citations (Scopus)

Abstract

In the copper electro-refining process, short circuiting between the cathode and anode caused by nodulation has the largest impact on the loss of current efficiency. In order to improve current efficiency, it is critically important to study the mechanism of the growth of the nodule. In this study, the nodulation was modeled using the finite element method to simulate the growth of copper bumps attached to the cathode. By considering the scale of the electrodes and their pitch, the relationship between the height of the nodule and its growth rate is investigated. In particular, a threshold height of the nodule that determines whether the nodule will rapidly grow to come in contact with the adjacent anode is identified. By comparing the result of the simulation and the experiments, the effect of leveling additives and the generation of dendritic growth are discussed.

Original language	English
Title of host publication	Rare Metal Technology 2018
Editors	Takanari Ouchi, Neale R. Neelameggham, Shijie Wang, Xiaofei Guan, Bradford Wesstrom, Shafiq Alam, Hojong Kim, Gisele Azimi
Publisher	Springer International Publishing
Pages	215-222
Number of pages	8
ISBN (Print)	9783319723495
DOIs	https://doi.org/10.1007/978-3-319-72350-1_20
Publication status	Published - 2018
Event	International Symposium on Rare Metal Technology, 2018 - Phoenix, United States Duration: 2018 Mar 11 → 2018 Mar 15

Publication series

Name	Minerals, Metals and Materials Series
Volume	Part F5
ISSN (Print)	2367-1181
ISSN (Electronic)	2367-1696

Conference

Conference	International Symposium on Rare Metal Technology, 2018
Country/Territory	United States
City	Phoenix
Period	18/3/11 → 18/3/15

Keywords

Copper
Electro-refining
FEM
Nodulation
Simulation

Access to Document

10.1007/978-3-319-72350-1_20

Cite this

Adachi, K., Nakai, Y., Kitada, A., Fukami, K., & Murase, K. (2018). FEM simulation of nodulation in copper electro-refining. In T. Ouchi, N. R. Neelameggham, S. Wang, X. Guan, B. Wesstrom, S. Alam, H. Kim, & G. Azimi (Eds.), Rare Metal Technology 2018 (pp. 215-222). (Minerals, Metals and Materials Series; Vol. Part F5). Springer International Publishing. https://doi.org/10.1007/978-3-319-72350-1_20

Adachi, Ken ; Nakai, Yuya ; Kitada, Atsushi et al. / FEM simulation of nodulation in copper electro-refining. Rare Metal Technology 2018. editor / Takanari Ouchi ; Neale R. Neelameggham ; Shijie Wang ; Xiaofei Guan ; Bradford Wesstrom ; Shafiq Alam ; Hojong Kim ; Gisele Azimi. Springer International Publishing, 2018. pp. 215-222 (Minerals, Metals and Materials Series).

@inproceedings{3b28ec2d13964732a4b76195b4d9c8cd,

title = "FEM simulation of nodulation in copper electro-refining",

abstract = "In the copper electro-refining process, short circuiting between the cathode and anode caused by nodulation has the largest impact on the loss of current efficiency. In order to improve current efficiency, it is critically important to study the mechanism of the growth of the nodule. In this study, the nodulation was modeled using the finite element method to simulate the growth of copper bumps attached to the cathode. By considering the scale of the electrodes and their pitch, the relationship between the height of the nodule and its growth rate is investigated. In particular, a threshold height of the nodule that determines whether the nodule will rapidly grow to come in contact with the adjacent anode is identified. By comparing the result of the simulation and the experiments, the effect of leveling additives and the generation of dendritic growth are discussed.",

keywords = "Copper, Electro-refining, FEM, Nodulation, Simulation",

author = "Ken Adachi and Yuya Nakai and Atsushi Kitada and Kazuhiro Fukami and Kuniaki Murase",

note = "Publisher Copyright: {\textcopyright} The Minerals, Metals & Materials Society 2018.; International Symposium on Rare Metal Technology, 2018 ; Conference date: 11-03-2018 Through 15-03-2018",

year = "2018",

doi = "10.1007/978-3-319-72350-1_20",

language = "English",

isbn = "9783319723495",

series = "Minerals, Metals and Materials Series",

publisher = "Springer International Publishing",

pages = "215--222",

editor = "Takanari Ouchi and Neelameggham, {Neale R.} and Shijie Wang and Xiaofei Guan and Bradford Wesstrom and Shafiq Alam and Hojong Kim and Gisele Azimi",

booktitle = "Rare Metal Technology 2018",

}

Adachi, K, Nakai, Y, Kitada, A, Fukami, K & Murase, K 2018, FEM simulation of nodulation in copper electro-refining. in T Ouchi, NR Neelameggham, S Wang, X Guan, B Wesstrom, S Alam, H Kim & G Azimi (eds), Rare Metal Technology 2018. Minerals, Metals and Materials Series, vol. Part F5, Springer International Publishing, pp. 215-222, International Symposium on Rare Metal Technology, 2018, Phoenix, United States, 18/3/11. https://doi.org/10.1007/978-3-319-72350-1_20

FEM simulation of nodulation in copper electro-refining. / Adachi, Ken; Nakai, Yuya; Kitada, Atsushi et al.
Rare Metal Technology 2018. ed. / Takanari Ouchi; Neale R. Neelameggham; Shijie Wang; Xiaofei Guan; Bradford Wesstrom; Shafiq Alam; Hojong Kim; Gisele Azimi. Springer International Publishing, 2018. p. 215-222 (Minerals, Metals and Materials Series; Vol. Part F5).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - FEM simulation of nodulation in copper electro-refining

AU - Adachi, Ken

AU - Nakai, Yuya

AU - Kitada, Atsushi

AU - Fukami, Kazuhiro

AU - Murase, Kuniaki

N1 - Publisher Copyright: © The Minerals, Metals & Materials Society 2018.

PY - 2018

Y1 - 2018

N2 - In the copper electro-refining process, short circuiting between the cathode and anode caused by nodulation has the largest impact on the loss of current efficiency. In order to improve current efficiency, it is critically important to study the mechanism of the growth of the nodule. In this study, the nodulation was modeled using the finite element method to simulate the growth of copper bumps attached to the cathode. By considering the scale of the electrodes and their pitch, the relationship between the height of the nodule and its growth rate is investigated. In particular, a threshold height of the nodule that determines whether the nodule will rapidly grow to come in contact with the adjacent anode is identified. By comparing the result of the simulation and the experiments, the effect of leveling additives and the generation of dendritic growth are discussed.

AB - In the copper electro-refining process, short circuiting between the cathode and anode caused by nodulation has the largest impact on the loss of current efficiency. In order to improve current efficiency, it is critically important to study the mechanism of the growth of the nodule. In this study, the nodulation was modeled using the finite element method to simulate the growth of copper bumps attached to the cathode. By considering the scale of the electrodes and their pitch, the relationship between the height of the nodule and its growth rate is investigated. In particular, a threshold height of the nodule that determines whether the nodule will rapidly grow to come in contact with the adjacent anode is identified. By comparing the result of the simulation and the experiments, the effect of leveling additives and the generation of dendritic growth are discussed.

KW - Copper

KW - Electro-refining

KW - FEM

KW - Nodulation

KW - Simulation

UR - http://www.scopus.com/inward/record.url?scp=85042415808&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85042415808&partnerID=8YFLogxK

U2 - 10.1007/978-3-319-72350-1_20

DO - 10.1007/978-3-319-72350-1_20

M3 - Conference contribution

AN - SCOPUS:85042415808

SN - 9783319723495

T3 - Minerals, Metals and Materials Series

SP - 215

EP - 222

BT - Rare Metal Technology 2018

A2 - Ouchi, Takanari

A2 - Neelameggham, Neale R.

A2 - Wang, Shijie

A2 - Guan, Xiaofei

A2 - Wesstrom, Bradford

A2 - Alam, Shafiq

A2 - Kim, Hojong

A2 - Azimi, Gisele

PB - Springer International Publishing

T2 - International Symposium on Rare Metal Technology, 2018

Y2 - 11 March 2018 through 15 March 2018

ER -

FEM simulation of nodulation in copper electro-refining

Abstract

Publication series

Conference

Keywords

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