FeRAM device and circuit technologies fully compatible with advanced CMOS

H. Toyoshima, S. Kobayashi, J. Yamada, T. Miwa, H. Koike, H. Takeuchi, H. Mori, N. Kasai, Y. Maejima, A. Seike, N. Tanabe, T. Tatsumi, H. Hada

Research output: Contribution to journalConference articlepeer-review

2 Citations (Scopus)


Recent progress in FeRAM device and circuit technologies that are fully compatible with advanced logic CMOS is described. We have developed a ferroelectric capacitor of a CMVP (capacitor-on-Metal/Via-stacked-Plug) memory cell that is fabricated after the completion of multilevel metallization. A 0.35-μm 2T/2C FeRAM macro based on CMVP has been fabricated for smart card applications. The chip features a wide operation voltage range, high write/read endurance, low consumption current, and a flexible memory size. The CMVP technologies also enable a 0.25-μm ASIC SRAM macro to be nonvolatile (NV-SRAM: nonvolatile SRAM). The memory cell consists of a six-transistor SRAM cell and two stacked back-up ferroelectric capacitors. A Vdd/2 plate line architecture makes read/write fatigue virtually negligible.

Original languageEnglish
Pages (from-to)171-178
Number of pages8
JournalProceedings of the Custom Integrated Circuits Conference
Publication statusPublished - 2001 Jan 1
Externally publishedYes
EventIEEE 2001 Custom Integrated Circuits Conference - San Diego, CA, United States
Duration: 2001 May 62001 May 9

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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