TY - GEN
T1 - 'FlexTrate ^TM' - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP
AU - Fukushima, Takafumi
AU - Alam, Arsalan
AU - Wan, Zhe
AU - Jangam, Siva C.
AU - Pal, Saptadeep
AU - Ezhilarasu, Goutham
AU - Bajwa, Adeel
AU - Iyer, Subramanian S.
N1 - Funding Information:
The Defense Advanced Research Projects Agency (DARPA) through ONR grant N00014-16-1-263 and the UCLA CHIPS Consortium supported this work. Part of the experimental work was performed in the Integrated Systems Nanofabrication Cleanroom (ISNC) of California NanoSystem Institute (CNSI) in UCLA and the Nanoelectronics Research Facility (NRF). The authors gratefully acknowledge the support of K&S and staff at ISNC and NRF. The views, opinions and/or findings expressed are those of the authors and should not be interpreted as representing the official views or policies of the Department of Defense or the U.S. Government. The authors gratefully acknowledge the support of Global INTegration Initiative (GINTI) in Tohoku University, Japan. We also would like to acknowledge Dow Corning and NITTO for their material support and cyberTECHNOLOGIES for their measurement support.
PY - 2017/8/1
Y1 - 2017/8/1
N2 - We have developed a novel fan-out wafer level packaging (FOWLP) technology for high-performance and scalable flexible and biocompatible substrates that we call FlexTrate (TM). We demonstrate the technology with the assembly of 1-mm-sqaure 625 (25 by 25) Si dielets on a biocompatible Polydimethylsiloxane (PDMS). By using the new FOWLP technology, die-die interconnects with a pitch of 10 mm or less were implemented on the array of the Si dielets embedded in the PDMS.
AB - We have developed a novel fan-out wafer level packaging (FOWLP) technology for high-performance and scalable flexible and biocompatible substrates that we call FlexTrate (TM). We demonstrate the technology with the assembly of 1-mm-sqaure 625 (25 by 25) Si dielets on a biocompatible Polydimethylsiloxane (PDMS). By using the new FOWLP technology, die-die interconnects with a pitch of 10 mm or less were implemented on the array of the Si dielets embedded in the PDMS.
KW - Bendable interconnect
KW - Biocompatible
KW - FOWLP
KW - Flexible device integration
KW - Metallization of PDMS
UR - http://www.scopus.com/inward/record.url?scp=85028064889&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85028064889&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2017.226
DO - 10.1109/ECTC.2017.226
M3 - Conference contribution
AN - SCOPUS:85028064889
T3 - Proceedings - Electronic Components and Technology Conference
SP - 649
EP - 654
BT - Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 67th IEEE Electronic Components and Technology Conference, ECTC 2017
Y2 - 30 May 2017 through 2 June 2017
ER -