Flip chip bonding technology to realize highly functional MEMS

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	456-460
Number of pages	5
Journal	Journal of Japan Institute of Electronics Packaging
Volume	11
Issue number	6
DOIs	https://doi.org/10.5104/jiep.11.456
Publication status	Published - 2008 Sept
Externally published	Yes

ASJC Scopus subject areas

@article{0c7fa22643f44280ad73c5e6d7a6d3de,

title = "Flip chip bonding technology to realize highly functional MEMS",

author = "Eiji Higurashi",

year = "2008",

month = sep,

doi = "10.5104/jiep.11.456",

language = "English",

volume = "11",

pages = "456--460",

journal = "Journal of Japan Institute of Electronics Packaging",

issn = "1343-9677",

publisher = "The Japan Institute of Electronics Packaging",

number = "6",

}

TY - JOUR

T1 - Flip chip bonding technology to realize highly functional MEMS

AU - Higurashi, Eiji

PY - 2008/9

Y1 - 2008/9

UR - http://www.scopus.com/inward/record.url?scp=84871037272&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84871037272&partnerID=8YFLogxK

U2 - 10.5104/jiep.11.456

DO - 10.5104/jiep.11.456

M3 - Article

AN - SCOPUS:84871037272

SN - 1343-9677

VL - 11

SP - 456

EP - 460

JO - Journal of Japan Institute of Electronics Packaging

JF - Journal of Japan Institute of Electronics Packaging

IS - 6

ER -