TY - GEN
T1 - Flipped CMOS-diaphragm capacitive tactile sensor surface mountable on flexible and stretchable bus line
AU - Asano, S.
AU - Muroyama, Masanori
AU - Bartley, T.
AU - Kojima, T.
AU - Nakayama, T.
AU - Yamaguchi, U.
AU - Yamada, H.
AU - Nonomura, Y.
AU - Hata, Y.
AU - Funabashi, H.
AU - Tanaka, S.
PY - 2015/8/5
Y1 - 2015/8/5
N2 - The following novel configuration has been developed for a MEMS-CMOS integrated tactile sensor on a flexible and stretchable bus for covering a social robot body: 1) a sensing diaphragm is formed on a CMOS substrate by backside etching, and 2) the CMOS substrate is flip-bonded to a low temperature co-fired ceramic (LTCC) substrate. By this configuration, no through-silicon vias (TSVs) are needed, simplifying the fabrication process. The flipped CMOS substrate and the LTCC substrate were bonded and electrically connected using Au-Au bonding, which also formed differential capacitive gaps. A flexible and stretchable wire was fabricated by metal etching and polyimide laser cutting. The tactile sensors, which were mounted on the surface of the flexible bus, sent coded digital signals according to applied force.
AB - The following novel configuration has been developed for a MEMS-CMOS integrated tactile sensor on a flexible and stretchable bus for covering a social robot body: 1) a sensing diaphragm is formed on a CMOS substrate by backside etching, and 2) the CMOS substrate is flip-bonded to a low temperature co-fired ceramic (LTCC) substrate. By this configuration, no through-silicon vias (TSVs) are needed, simplifying the fabrication process. The flipped CMOS substrate and the LTCC substrate were bonded and electrically connected using Au-Au bonding, which also formed differential capacitive gaps. A flexible and stretchable wire was fabricated by metal etching and polyimide laser cutting. The tactile sensors, which were mounted on the surface of the flexible bus, sent coded digital signals according to applied force.
KW - Au-Au bonding
KW - MEMS-CMOS integration
KW - Stretchable wire
KW - Surface mounting
KW - Tactile sensor
KW - Wafer-level packaging
UR - http://www.scopus.com/inward/record.url?scp=84955438439&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84955438439&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2015.7180870
DO - 10.1109/TRANSDUCERS.2015.7180870
M3 - Conference contribution
AN - SCOPUS:84955438439
T3 - 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
SP - 97
EP - 100
BT - 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
Y2 - 21 June 2015 through 25 June 2015
ER -