@inproceedings{e1c1149c27284ae08ecbd90d59d3d1cb,
title = "Formation of extremely high-aspect Si sub-micron patterns with smooth wall for MEMS and X-ray devices",
abstract = "Sub-micron wide Si rib patterns with a smooth sidewall and a high aspect ratio have been successfully formed using originally developed dry-etching apparatus with a high-density inductive coupled plasma source. The developed technique is applied for MEMS and X-ray devices.",
keywords = "high aspect Si patterns, ICP-RIE, imprint, MEMS, metallic glasss, smooth sidewall, X-ray devices",
author = "Hayato Komatsu and Wataru Yashiro and Hidemi Kato and Johji Kagami and Kentaro Totsu and Masashi Nakao",
note = "Publisher Copyright: {\textcopyright} 2017 Japan Institute of Electronics Packaging.; 2017 International Conference on Electronics Packaging, ICEP 2017 ; Conference date: 19-04-2017 Through 22-04-2017",
year = "2017",
month = jun,
day = "5",
doi = "10.23919/ICEP.2017.7939428",
language = "English",
series = "2017 International Conference on Electronics Packaging, ICEP 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "487--490",
booktitle = "2017 International Conference on Electronics Packaging, ICEP 2017",
address = "United States",
}