Forming long Ag thin wires by using stress migration

Engineering

• Passivation 40%
• Tensile Stress σ 40%
• Brittle Fracture 40%
• Crack 40%
• Multilayers 40%
• Deposited Film 20%
• Driving Force 20%
• Compressive Stress 20%
• Impact Toughness 20%
• Atmospheric Condition 20%
• Stress Gradient 20%
• Potential Application 20%
• Integrated Circuit 20%
• Atomic Diffusion 20%
• Material Component 20%
• Forming 20%
• Generates 20%
• Heating 20%

Material Science

• Liquid Films 100%
• Crack 40%
• Fracture Toughness 20%
• Electrode 20%
• Adhesion 20%
• Metal Foil 20%